Just yesterday Honor started teasing its upcoming foldable smartphone, the Honor Magic V. The company hasn’t outed any details about it, aside from letting us know that it is in fact going to be Honor’s “first foldable flagship”, and that it’s coming soon.
According to a leaked presentation slide that surfaced in China, however, we get another bit of info about Honor’s upcoming foldable – namely that it will use the Snapdragon 8 Gen 1 chipset. It will, in fact, be the first foldable device to do so, although definitely not the last – we’re expecting a lot more entries in this category in 2022.
Rumor has it the Magic V will be fully unveiled next month. We’re expecting a lot more details about it to become public before then, so stay tuned.
According to previous leaks, the Honor Magic V will have a 6.5″ cover display and an 8″ internal screen (when unfolded). Both panels are allegedly supplied by BOE.
Source (in Chinese) | Via