Realme has confirmed that it will be one of the first smartphone makers to leverage the power of MediaTek’s new Dimensity 1200 chipset. This is the first 6nm chipset from MediaTek and it will be Realme’s first 6nm chip as well, so the company is equally excited about the power savings it will enable in and the the extra speed.
And this will certainly be faster. Previous Dimensity chips used Cortex-A77 core (at least the 1000-series did) and they topped out at 2.6GHz. This one gets the new Cortex-A78 core and it will run it at 3.0GHz (according to ARM’s official numbers, this means 20% higher single-core performance).
A Realme phone will be one of the first to run on Dimensity 1200 power
The chipset features 5G connectivity, of course and will join the growing list of 5G-connected Realme phones. The company also mentioned AI applications in imaging and gaming that will leverage the more powerful NPU inside the new chip.
CEO Madhav Sheth has been teasing a new X-series phone and even posted a photo of the X9. You can’t see much, but it’s just part of the many “Xciting” teasers, but not much official detail yet.
We heard from a trusted source that the Realme X9 Pro will be the phone in question. Its Dimensity 1200 will be paired with up to 12GB of LPDDR5 RAM and 128/256 GB storage. The phone should launch with Android 11 with Realme UI 2.0.
According to our source, the X9 Pro will be the first Realme phone with a 108MP camera (and it will have two 13MP modules too, almost certainly telephoto plus ultrawide). It will have a 6.4” OLED display with 120Hz refresh rate and 1,080 x 2,400 px resolution and, finally, the 4,500 mAh battery will support 65W fast charging.
By the way, a Realme exec officially confirmed that the company is working on a Snapdragon 888-powered phone as well. That chip is fabbed at 5nm, so Realme’s 7nm era will end quickly as the company is about to embrace smaller nodes.